HRWSCPF4

• Designed primarily for copper to copper and copper to brass connections the paste form is ideal for soldering tube joints.
• Not recommended for electrical or electronic applications due to the potential corrosive residue of the flux.
• Stay Clean Paste flux works well with most leaded and lead-free solder compositions.
• Flux residue should be removed after soldering.
• Superior flux for most metals, copper, brass, bronze, steel, galvanized, Monel®.
• Not recommended for aluminum, magnesium, or titanium. Not recommended for electrical or electronic applications.
• Active Temperature: Up to 700°F/371°C
• J-STD Specification: A-A-51145SC, Form A